IC Training
TRAINING IN INTEGRATED CIRCUIT DESIGN AND VERIFICATION
Ignite National Technology Fund, under the Ministry of IT & Telecom, is seeking applications from experienced professionals in the startup ecosystem to join the advisory committee for Pakistan Startup Fund. PSF is the flagship startup fund by the Government of Pakistan, executed by Ignite under the Ministry of IT & Telecom.This committee will play a pivotal role in guiding PSF’s strategic direction, evaluating startup applications, and advising on investment trends to support Pakistan’s startup ecosystem.
Global demand for chip design and semiconductor professionals is rapidly increasing, driven by advancements in AI, IoT, and 5G. Pakistan, however, lacks specialized training and certifications aligned with international standards, limiting its talent’s access to high-value global opportunities. To address this gap, Ignite has launched a pilot program aimed at developing a skilled workforce in advanced chip design and semiconductor technologies.
This initiative is designed to train 30 individuals in cutting-edge chip design techniques, reducing reliance on foreign expertise while fostering local innovation and strengthening Pakistan’s position in the global semiconductor ecosystem.
The funding agreement between Ignite – National Technology Fund and FAST-NUCES was signed on June 23, 2025, with a total budget of PKR 24.9 million. The project spans 14 months, covering outreach, selection, training, and tape-out phases.
Trainee Selection & Onboarding
A rigorous, merit-based selection process was conducted between July and August 2025. A total of 33 trainees were selected through comprehensive testing and interviews.
Training Journey
Module 1 (Sep – Dec 2025)
Core chip design fundamentals completed successfully with a 100% success rate for Ignite candidates.
Module 2 (Jan – May 2026)
The second module, focused on advanced VLSI Design Verification and Tape-out, is a five-month training program currently in progress and expected to conclude by May 29, 2026.
Module 3 (June 26)
Tape-Out & Fabrication (July- Aug 26)
Courses Offered
Module 1 (4 Months Completed)
- A-1 Analog & Discrete Electronics
- A-2 Digital Integrated Circuit
- A-3 Digital ICs: Synthesis & Physical Design
- A-4 IC Design Project: From Concept to Chip Tapeout-I
- A-5 Research Methodology & Soft Skills-I
Module 2 (5 Months) In Progress
- B-1 Mixed Signal Integrated Circuit Design
- B-2 SoC, Packaging & Signal Integrity
- B-3 VLSI Design Verification & Test
- B-4 IC Design Project: From Concept to Chip Tapeout-II
- B-5 Research Methodology & Soft Skills-II
Module 3 (1 Month) Pending
- C-1 Report
- C-2 AI Applications in VLSI
Job Readiness
The program emphasizes hands-on experience with industry-standard tools and techniques, ensuring participants are fully equipped to contribute effectively to both local and global semiconductor industries.